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SOLDERING
CHEMISTRY
P.
Kay offers a full line of soldering fluxes developed
to ensure consistent, efficient and environmentally
friendly soldering. Designed primarily for the electronic
assembly market. P. Kay fluxes have found their way
into many electrical and industrial applications. Our
flux chemistry runs the gamut from Water Soluble to
No Clean and VOC Free formulations.
Our
rosin/resin free No Clean fluxes have set the standard
for solderability and post soldering cleanliness. Water
soluble fluxes are also available for customers utilizing
aqueous cleaning systems and who demand aesthetic cleanliness
with minimal ionic contamination.
P.
Kay Metal manufactures a complete line of no-wash rosin
based fluxes developed specifically for high volume
consumer electronics. All fluxes are formulated to be
used in foam, wave, spray, and dip applications. Custom
formulations are available upon request.
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NO
CLEAN & VOC FREE FLUXES
To
satisfy the need for a cosmetically appealing surface, and
bright shiny solder connections without cleaning, P. Kay has
developed a full line of No Clean Liquid Fluxes. These fluxes
were developed to guarantee an easier journey down the "environmentally
friendly" path. We're committed to improving the environment...one
connection at a time.
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Formula
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Type
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Solids %
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Specific Gravity
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Thinner
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Halide Content
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Application
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Applicable
Specifications
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Removal
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113
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No Clean
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3.65
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0.795
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#200
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0
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Foam, spray, Wave, Dip
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Bellicore
TR-TSY-000078
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IPC SF 818 class 3
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NO
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113S
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No Clean
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3.05
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0.793
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#200
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0
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Spray, Wave
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Bellicore
TR-TSY-000078
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IPC SF 818 class 3
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NO
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213
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No Clean
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3.65
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0.796
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#200
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0
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Foam, Spray, Wave, Dip
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Bellicore
TR-TSY-000078
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IPC SF 818 class 3
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NO
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213S
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No Clean
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3.05
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0.793
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#200
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0
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Spray, Wave
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Bellicore
TR-TSY-000078
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IPC SF 818 class 3
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NO
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T25
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No Clean
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3.00
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0.812
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#200
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0
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Spray, Wave, Dip
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Bellicore
TR-TSY-000078
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IPC SF 818 class 3
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NO
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H9
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VOC Free
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2.75
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1.010
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Deionized Water
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0
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Spray, Dip
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Bellicore
TR-NWT-000078
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J-STD-004 TYPE "LO"
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NO
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ROSIN
FLUXES
The
proven reliability of low solids rosin flux for consistent
soldering with minimal residue makes it a natural choice for
traditional soldering application.
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Formula
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Type
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Solids %
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Specific
Gravity
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Halide Content
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Thinner
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Application
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Removal
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DW-400
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Rosin
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< 4.00
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0.804
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< .10%
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SM-12RXA
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Foam, Spray, Wave
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NOT REQUIRED
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CS-12RX
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Rosin
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< 15.00
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0.825
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< .30%
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SM-12RXA
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Foam, Spray, Wave
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NOT REQUIRED
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WATER
SOLUBLE FLUXES
Water soluble fluxes
are highly activated and require the use of aqueous cleaning
systems. These fluxes produce bright, reliable solder connections
under challenging soldering conditions.
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Formula
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Type
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Solids %
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Specific
Gravity
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Thinner
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Application
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Applicable
Specifications
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Removal
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SM 510
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Water Soluble
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10.00
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0.910
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300A
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Foam, Spray, Wave, Dip
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MIL STD 2000
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J-STD-004
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Deionized Water
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SM 5W
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Water Soluble
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18.30
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0.955
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300A
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Foam, Spray, Wave, Dip
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MIL STD 2000
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J-STD-004
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Deionized Water
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SM 2w
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Water Soluble
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9.15
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0.878
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300A
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Foam, Stray, Wave, Dip
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MIL STD 2000
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IJ-STD-004
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Deionized Water
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