|
Performance
Characteristics
|
Extremely
mild, for military and very clean electronic assembly
surfaces.
|
Mild
for military and electronic assemblies
|
General
use in electronic and electrical assembly.
|
Cosmetically
clean appearance after soldering. Similar to RMA in
terms of activity.
|
Very
active, residue easily removed.
|
|
Residue
Removal
|
Not
required but solvent or saponifier soluble.
|
Not
required but solvent or saponifier soluble.
|
Generally
not required but solvent or saponifier soluble
|
Not
required but solvent or saponifier soluble.
|
Residue
must be removed. Neutralizer and warm water required
|
|
Use
on these surfaces
|
Platinum,
Gold, Copper, Tin, Silver, Palladium, Solder
|
Platinum,
Gold, Copper, Tin, silver, Palladium, Solder
|
Same
as RMA plus; Nickel, Cadmium, Brass, Lead, Bronze, Beryllium
Copper
|
Platinum,
Gold, Copper, Tin, Silver, Palladium, Solder
|
Same
as: R.A. plus: Kovar, Nickel-Iron
|